BerandaVideoSubstrat Keramik DBC Bonding Direct Copper

Substrat Keramik DBC Bonding Direct Copper

Kami memasok berbagai substrat keramik DBC, DPC metalisasi dalam pilihan keramik teknis, terutama termasuk alumina kemurnian tinggi (AL2O3), zirkonia (ZRO2), aluminium nitrida (ALN), dan silikon nitrida (Si3N4). Lapisan tembaga lapisan dasar dapat berupa pelapisan nikel, pelapisan perak, pelapisan emas sesuai dengan aplikasi spesifik pelanggan.

2022/08/30

BerandaVideoSubstrat Keramik DBC Bonding Direct Copper

Hak cipta © 2024 Jinghui Industry Ltd. semua hak dilindungi.

We will contact you immediately

Fill in more information so that we can get in touch with you faster

Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.

Kirim